Polycrystalline Diamond Cutter PDC
DiaPac™ PDC consists of a sintered layer of polycrystalline diamond integrally bonded to a tungsten carbide substrate during a high pressure/high temperature synthesis process. The diamond layer provides exceptional wear resistance while maintaining a sharp cutting edge, while the tungsten carbide substrate provides solid support for the diamond table and allows the cutter to be brazed into a drill bit or tool holder.
